PM Inaugurates CG Semi OSAT Semiconductor Facility in Gujarat
The Prime Minister said the commencement of commercial chip packaging at the facility reflects India's commitment to becoming a global technology and semiconductor manufacturing hub under the "Design in India" and "Make in India" initiatives.
The CG Semi OSAT facility has an initial production capacity of 20 crore semiconductor units annually, with plans to scale up to 500 crore units per year. The project has been developed through a partnership involving Indian, Japanese and Thai companies, highlighting international collaboration in India's semiconductor sector.
Addressing employees and industry representatives, the Prime Minister said semiconductor manufacturing requires the development of a complete ecosystem comprising component manufacturers, testing laboratories, design centres, chemical suppliers and startups. He added that Sanand is emerging as a semiconductor manufacturing cluster with multiple companies establishing operations in the region.
The Prime Minister highlighted that companies including Micron, Kaynes and CG Semi have recently begun production, creating a strong semiconductor ecosystem that is expected to generate employment and attract further investments.
He said India's electronics manufacturing sector has witnessed significant growth over the past decade, with electronics production increasing nearly sevenfold and exports rising elevenfold compared to 2014 levels. India has also emerged as the world's second-largest manufacturer and exporter of mobile phones, he added.
The Prime Minister said the country's focus has now expanded from manufacturing finished electronic products to producing key components, including semiconductors, with the objective of establishing a complete domestic value chain.
He also emphasised the importance of developing capabilities in critical minerals, semiconductor materials, chip design and advanced packaging to strengthen India's long-term technological self-reliance.
Published on:
06 July 2026
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